By C. H. Stapper (auth.), C. H. Stapper, V. K. Jain, G. Saucier (eds.)

Higher circuit densities, a growing number of complicated program ohjectives, and complex packaging applied sciences have suhstantially elevated the necessity to contain defect-tolerance and fault-tolerance within the layout of VLSI and WSI platforms. The pursuits of defect-tolerance and fault-tolerance are yield enhancement and more desirable reliahility. The emphasis in this zone has ended in a brand new box of interdisciplinary clinical study. I n truth, complicated tools of defect/fault keep an eye on and tolerance are leading to superior manufacturahility and productiveness of built-in circuit chips, VI.SI structures, and wafer scale built-in circuits. In 1987, Dr. W. Moore equipped an "International Workshop on Designing for Yield" at Oxford college. Edited papers of that workshop have been released in reference [II. The members in that workshop agreed that conferences of this sort may still he con­ tinued. preferahly on a each year hasis. It was once Dr. I. Koren who prepared the "IEEE Inter nationwide Workshop on illness and Fault Tolerance in VLSI platforms" in Springfield Massachusetts the following yr. chosen papers from that workshop have been puhlished because the first quantity of this sequence [21.

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87-94, March 1981. , "Defect Analysis and Yield Degradation of Integrated Circuits", IEEE Journal of SolidState Circuits, SC-9(3), pp. 96-103, 1974. [24] A. Gupta and J. W. Lathrop, "Yield Analysis of Large Integrated Circuit Chips, "IEEE J. Solid-State Circuits, vol. 5, pp. 389-395, Oct. 1972. [25] A. W. Lathrop, "Comments on 'Influence of Epitaxial Mounds on the Yield of Integrated Circuits'," Proc. IEEE, vol. 58, no. 12, pp. 1960-1961, December 1970. E. Ham, "Yield-Area Analysis: Part I-A Diagnostic Tool for Fundamental Integrated Circuit Process Problems," RCA Review, vol.

For each fixed value of B, divide all the given wafers into windows of size B (thus having T = ~IS windows) and then count the number of defects in each window denoting by X, the number of defects in window i, (i = 1, ... , T). eter The first approach estimates B by utiHzing the fact that the clustering paramis fixed for all areas within a block while it increases when the area consists of 0: 43 more than one block. For each fixed B, 0: is estimated using, for example, the following moment-method estimator.

25 trade offs between the basic characteristics of different methodologies. The most important of them is the fidelitycost of computation trade off, which is typical for any engineering activity. 4. CONCLUSIONS The goal of this paper was to evaluate basic yield estimations methodologies describe in the literature and used in solving a number of design and manufacturing tasks. e to the limited size of this paper only a superficial and qualitative in nature evaluation was possible. But even such a limited in depth and scope evaluation leads to a couple of perhaps important conclusions and observations.

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